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The assembly of graphene and other two-dimensional materials into artificial crystals termed van-der-Waals stacks has great potential to produce new materials without precedence in nature and develop novel electronic devices To reliably assemble 2D materials into such structures, however, a better understanding of the transfer process is required. Here we report a quantitative approach to examining the adhesion behavior during viscoelastic stamping of 2D materials. By measuring the adhesion of graphene to different carrier substrates and varying the peeling speed we have identified the range of adhesion of samples. The result shows that the adhesion occurs between graphene-graphene and graphene-SiO2 substrate have a higher value than the ability of PDMS stamp to pick up. A surface modification and an alternative substrate are needed to make the adhesion lower. With proper improvement, this work can be an option to realize an effective fabrication method of a two-dimensional heterostructure device.