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Preparation of Chitosan-TiO2 Antimicrobial Nanocomposite Film for Potential Food Packaging Application
Dhena Ria Barleany (a*), Indar Kustiningsih (a), Devi Abriyani (a), Muhammad Shairazy (a), Asep Ridwan (b)

a) Department of Chemical Engineering, Faculty of Engineering, University of Sultan Ageng Tirtayasa, Jln. Jenderal Sudirman Km. 03, Cilegon, Banten, Indonesia
*ria.barleany[at]untirta.ac.id
b) Department of Industrial Engineering, Faculty of Engineering, University of Sultan Ageng Tirtayasa, Jln. Jenderal Sudirman Km. 03, Cilegon, Banten, Indonesia


Abstract

Polysaccharides are potential materials for food packaging due to their biodegradability and non-toxicity. Polysaccharides have some disadvantages like poor mechanical properties and low resistance to water. Nanomaterials could be used to enhance the thermal, mechanical and gas barrier properties without obstructing their biodegradable and non-toxic characters. In the current study, a series of chitosan based biodegradable film nanocomposites containing different ratios of TiO2 nanoparticles were prepared through a process involving blending, solution casting and evaporation. The films were characterized to explore the effects of different TiO2 nanoparticle contents to their mechanical properties and the antibacterial activity. Results showed that TiO2 addition led to improve mechanical properties of the composite film. The tensile strength of chitosan-TiO2 films reaching a maximum of 29,46 MPa and elongation at break of 8,67 % at 0,2 wt % TiO2 nanoparticles. The biodegradation study of chitosan film with 0,2 TiO2 showed 50 % of weight loss after 2 months of composting. All chitosan-TiO2 films prepared in this study possessed efficient antimicrobial activity against Staphylococcus aureus with 100% sterilization in 24 h under UV light and dark condition.

Keywords: antimicrobial plastics, chitosan, composite, TiO2

Topic: Chemical Engineering

Link: https://ifory.id/abstract/tZLRXa2uMgQx

Conference: Broad Exposure on Science and Technology (BEST 2019)

Plain Format | Corresponding Author (Dhena Ria Barleany)

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